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June 2010 | Follow MIG on: www.memsindustrygroup.org · LinkedIn · Twitter · Facebook · MEMSblog

In this issue:

  1. MEMS Industry Group News
  2. Analyst Corner
  3. Member & Industry News



Sharpen Your Knowledge at MEMS Education Series: MEMS Test & Reliability Short Course


Early Bird Discount Ends JUNE 15

This short course will provide an overview of the business aspects of the critical areas of MEMS test and reliability. Instructor John McKillop, managing director, Tekton Consulting, will examine MEMS test and reliability in three business cases: emerging technology products, low volume products, and high volume consumer products.

You don’t need another boring lecture. Lively, provocative, and yes, even fun, dialogue between the instructor and participants will be a vital component to this course.

Before you head to SEMICON West this year, don’t miss this exciting opportunity to learn and ask plenty of questions about MEMS test and reliability.

Register at www.memseducationseries.com by JUNE 15 to receive $50 off registration.

MEMS Education Series: MEMS Test & Reliability Short Course
Monday, July 12, 2010 from 1:00pm – 4:00pm
San Francisco State University Downtown Campus

To register or learn more about the course, visit www.memseducationseries.com.

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MIG Members Tackle MEMS Fabrication Challenges and Draft Action Items at METRIC 2010


Excitement was in the air as MIG members converged on to the Wyndham San Jose for MIG’s tenth annual METRIC conference. MEMS fabrication issues took center stage this year as members broke into working groups to identify key opportunities for MEMS fabrication and create action items for MIG and the industry to address them.

A few key takeaways from METRIC:

  • It’s time to improve communication between MEMS fabs and device manufacturers by creating a foundry check list.
  • Integration is critical: the MEMS industry needs to start thinking in the context of the system, not just the MEMS device.
  • The future is fab-less!

Want to know more? MIG members can access the METRIC 2010 Optimizing MEMS Fabrication Portal at www.memsindustrygroup.org/METRIC2010 for all materials, presentations and video clips from the conference. Check out the METRIC wrap-up article on MEMSblog as well for a summary of the event.



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MEMS Executive Congress 2010: Panels To Be Announced Soon, Sponsorships Available For a Limited Time


Preparations for MEMS Executive Congress 2010--November 3-5, Scottsdale, AZ--are in full swing and MIG is gearing up to make some exciting announcements in the coming weeks. Expect an email announcing panelists and inviting you to register coming your way very soon. In the meantime, there's already quite a bit of information on www.memscongress.com, with more added daily.

Sponsorships for budgets of all sizes are still available for a limited time. If your company is seeking to promote itself to a targeted audience of MEMS and end-user executives, contact Karen Lightman today!



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CALL FOR PARTICIPATION: MIG is Seeking Action Item Committee Chairs


As a follow up to METRIC 2010, MIG will be setting up an Action Item Committee to implement the recommended action items from the conference. Suggestions for action items for MIG included developing checklist for partnering with a foundry, creating a roadmap, and drafting a list of priority standards for standards organizations such as NIST and SEMI.

MIG is looking for members to co-chair the committee and help MIG accomplish these action items. Interested parties should contact Monica Takacs.



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Schedule a MIG Member Orientation Webinar Starting This July


As a MIG member, there's a wealth of resources and benefits available to you. Sometimes it's hard to know where to start or how to best take advantage of MIG's resources. That is why MIG will be launching monthly member orientation webinars in July to better inform members about their memberships.

If you would like to have MIG set up a webinar for YOU and/or colleagues at your company, please contact Monica Takacs.



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ST and Asian players gain share, as Top 20 MEMS foundries slightly outperform sector


Contributed by Jean-Christophe Eloy, President & CEO, and Jérôme Mouly, MEMS Technology and Market Analyst,Yole Développement

Double digit growth at Taiwan’s Asia Pacific Microsystems (APM) and Touch Microsystems (TMT) also help push the combined share of these companies in Taiwan to close to 9% of total Top 20 foundry revenues, which represent the vast majority about 96% of global MEMS foundry revenues of the total MEMS foundry market. That’s still a small part of the total, but it’s almost double the share last year.

Foundries continued to gradually take on a larger portion of total MEMS production, with total foundry revenues at the Top 20 total declining about 3%, slightly less than the roughly 5% drop in MEMS sector revenues overall.

Dalsa Corp. significantly outpaced the industry with 19% growth to become the largest independent MEMS foundry, and moved into third place in the rankings with $31 million in foundry revenues. It closed in a bit on number two Texas Instruments Inc., who saw a 24% drop to $45 million.

STMicroelectronics continues to dominate the foundry business, and increased its share in 2009 by about a point despite a 1% slip in foundry revenues, as many of the other major producers saw sales drop more sharply in the general downturn in consumer electronics and automotive applications.

Like the MEMS market overall, the foundry/fabless business is dominated by several big companies making established volume products— particularly STMicroelectronics producing the heater parts of fixed inkjet heads for Hewlett-Packard Co., while HP keeps its key polymer patterning process for the nozzles in house. ST’s revenues held up better than most because sales of printers with the fixed heads it makes for HP held relatively steady compared to those with disposable heads, and because of its healthy balance of customers.

Read the full article on MEMSblog



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Shifts Occurring in the MEMS Competitive Landscape


Contributed by Jérémie Bouchaud, Principal Analyst, MEM, iSuppli

iSuppli has just released its MEMS competitive analysis for 2010, which screens the revenue of almost 150 MEMS manufacturers—98% of the market—by device and application for the years spanning 2006 to 2009. Not only does this major ground-up and historical analysis provide a robust foundation for all MEMS forecasts at iSuppli, it also provides unique insights on the shifts induced by the crisis in the competitive landscape at the end of 2008 and in the second half of 2009. Finally, it helps to identify longer term trends like the growth of the fabless business or the importance of captive markets in the MEMS industry.

Avoiding Double Counting

iSuppli accounts the revenues of IDM and fabless manufacturers on the one hand and revenues from foundries on the other, contrary to rankings from other analysts. This separation of revenue avoids double counting and misunderstandings in publication of rankings. For example, the total revenue of STMicroelectronics in MEMS was $448 million in 2009. iSuppli counts the IDM revenue separately for sensors and lab-on-chip products on the one hand ($223 million) and the foundry revenue, mostly for inkjets for Hewlett-Packard and Xerox, on the other (estimated at $225 million).

Here are some high level findings of the “MEMS competitive analysis 2010”:
The MEMS revenue accrued by the top 110 IDM (Integrated Design Manufacturers i.e. in-house manufacturers) and fabless manufacturers was $5.7 billion in 2009, down 8.8% from 2008. This is slightly better than the -9.8% forecasted in Q4 2009 by iSuppli. The last four months of 2009 saw an impressive recovery of sensor production, especially for the automotive sector.

Read the full article on MEMSblog



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New & Renewing Member Spotlight


Welcome to the newest members of MEMS Industry Group:

Kilbrydon Consulting (www.kilbrydon.com)

Maradin Technologies Ltd. (www.maradin.co.il)

MEMS Foundry Itzehoe GmbH (www.memsfoundry.de)

MEMS and Nanotechnology Exchange (www.mems-exchange.org)

memsstar (www.memsstar.com)

Pinyen Lin, Consultant

MIG also thanks the following members that have so far renewed their memberships in 2010. MEMS Industry Group could not work to advance the global MEMS market without your support. We look forward to working with you for another year!

OMRON
Radant MEMS
Texas Instruments


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Recent Member News

For more member news, visit the Member & Industry News section of the MIG website.

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MIG Members Receive Discount for Sensors Expo & Conference 2010


Sensors Expo & Conference - June 7-9, 2010
Donald E. Stephens Convention Center - Rosemont, IL
www.sensorsexpo.com
Co-located with Embedded Systems Conference!

For 24 years, Sensors Expo & Conference has been the leading industry event focusing exclusively on sensors & sensor-integrated systems! The in-depth conference program features the world's leading authorities, in a carefully designed program, including topics:

  • Energy Harvesting
  • Wireless Networking
  • Low-Power Sensing
  • Bio-Sensing
  • MEMS & MCUs
  • Monitoring Tools & Applications
  • Novel Approaches to Measurement
  • Power/Smart Grid Monitoring & Control, and more!

PLUS save months of time researching, by examining solutions to your toughest sensing challenges from best-in-class vendors on the Expo floor! Whether you're looking to find the latest sensing solutions, evaluate emerging standards, find and compare suppliers, or solve new design challenges, you can't afford to miss Sensors Expo & Conference!

Register today at www.sensorsexpo.com using source code: F374H and receive $50 off a Gold or Main Conference Pass or a FREE Expo Hall Pass ñ just for being a member of MEMS Industry Group!



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MIG Members Receive $50 Discount to “Thinking Outside the Chip” Pre-conference Session at Sensors Expo


On June 7, 2010, Roger Grace Associates will host “Think Outside the Chip: MEMS-Based Systems Solutions,” an all-day pre-conference session at Sensors Expo (Rosemont, IL) featuring 15 speakers addressing the topic of MEMS-based system solutions.

The session will address various issues and tradeoffs necessary in creating successful MEMS-based systems, especially in the selection of signal processing circuits, including ASICs and DSP, as well as embedded software. The presentations will also highlight some of the many rapidly emerging applications of this concept. Please visit the www.sensorsexpo.com for complete details.

Highlights include:

  • Morning Keynote: Professor Thomas Gessner, Fraunhofer Chemnitz
    “Examples of Smart Systems Solutions: From Monitoring Systems to Micro Analysis Systems”
  • Afternoon Keynote: Dr. Peter Hartwell, HP Labs
    “Applying New MEMS Architecture to Achieve Low-Cost, Ultra-Sensitive Wireless Sensors for Mission Critical Applications”
  • Dr. Gereon Meyer,VDI/VDE
    “Thinking Outside the Chip: The European Platform of Smart Systems (EPoSS)”
  • Afternoon Panel Discussion: “Integration Tradeoffs for a Design for Manufacturing World”
    Including Karen Lightman, Managing Director, MEMS Industry Group

MIG members receive a $50 discount on pre-conference admission or for admission to the main conference, using the promotional code F326H when you register. For more information, www.sensorsexpo.com.



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Guide to MEMS Events at SEMICON West


Monday, July 12

1:00pm-4:00pm
MEMS Education Series: MEMS Test and Reliability Short Course
Dr. John McKillop discusses test and reliability issues and designing product qualification systems.
Downtown San Francisco State University Campus
www.memseducationseries.com

8:30am-5:00pm
MEMS standards meetings
Task force sessions on wafer bonding, microtubes, microfluidics, international terminology, reliability, materials characterization through the day, and the MEMS/NEMS committee meeting 3:00-5:00.

Tuesday, July 13

10:30am-12:30pm
Opportunities in MEMS: Growing the market with new applications, integrated functions and faster time to volume
Jean-Christophe Eloy will give Yole’s latest market update and discuss the new devices coming into volume production and the new challenges to simplify their use in more systems. STMicroelectronics’ Jalinous Esfandyari and Invensense’s Steve Nasiri discuss the future of MEMS sensors and the trends towards smarter and more integrated, higher volume, lower cost devices. Hewlett-Packard’s Peter Hartwell talks about HP’s new inertial sensors and the wireless networks they enable.

MIG’s Karen Lightman moderates a panel with ADI’s Asif Chowdhury, IMT’s John Foster, Micralyne’s Yan Loke and Tekton Consulting’s John McKillop in a discussion on optimizing manufacturing for future MEMS growth. Moscone South, Extreme Electronics TechXpot. Read more information

2:00pm-4:30pm
Micro Manufacturing for energy systems: Texas Instruments’ Mark Buccini updates on the current status of energy harvesting and micro battery systems enabling wireless sensor networks. IMEC’s Raffaella Borzi and MicroGen Systems Robert Andosca report on progress in MEMS energy harvesting. Leading microbattery suppliers IPS and Cymbet talk about the thin-film energy storage systems that make energy harvesting practical for these sensor systems. Moscone South, Extreme Electronics stage.

Other related events:

10:30am-1:00pm
Fab 2.0: New opportunities for the “next generation” fab.
Freescale (MEMS) and HP (inkjet heads) are among the companies talking about issue in re-purposing older fabs and using secondary equipment issues. Moscone South, Techsite.

1:00pm-5:00pm
SEMI/SEMATECH 3D Interconnect workshop: Challenges and Need for Standards
Speakers from Qualcomm, SEMATECH, IMEC, Amkor and others will talk about issues of 3D metrology, bonding, thin wafer handling and via hole characterization and explore where the sector might best benefit from standards to reduce costs and advance adoption of TSV technology. Marriott.

1:00pm-5:00pm
MEMS Energy Harvesting and Reliability Workshop
Dr. Ravi Doraiswami, research scientist at the University of Maryland, gives a course on MEMS energy harvesting and reliability. Marriott.

Thursday, July 15

11:00-11:30
Palo Alto Research Center (PARC) presents its work on flexible MEMS sensors on film at the Flexible Electronics session. Moscone South, Extreme Electronics stage.



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21st Exhibition Micromachine/MEMS Coming Soon with Robotech and Surtech in Japan


MicroNano2010, the leading event for the Micro/MEMS & Nanotechnologies sector in Japan, will take place at Tokyo International Exhibition Center (named TOKYO BIG SIGHT) on July 28-30, 2010.

Under the umbrella of MicroNano, Exhibition Micromachine/MEMS and the brand new exhibition ROBOTECH covering next generation Service Robot components and technologies, will be held together with several conferences and seminars.

Though the application deadline had been passed officially, there are still few exhibition booth available, please ask the following contacts ASAP.

Contact: Ms. Yamanouchi / Ms. Yokoyama
Exhibition Micromachine/MEMS: e-mail:info@micromachine.jp
ROBOTECH: e-mail:info@robotechexpo.jp

The Exhibition on surface technology, SURTECH2010 will be held concurrently with Exhibition Micromachine/MEMS and ROBOTECH in 2010! SURTECH organized by the Surface Finishing Society of Japan is a specialized exhibition on surface technology such as thin coating, paint application and thermal process. Since its first appearance as MET Show in 1962, the exhibition has served as a complete meeting point among the professionals in the related industry. As both surface technology and micromachine and nanotechnology are used at the similar industrial field, holding SURTECH and MicroNano concurrently will also bring synergistic effect to both events.

You can ask for the show tickets on our site, pre-registration is free of charge and JPY3,000 will be charged onsite registrations.

For more information, visit our website www.micromachine.jp/en/
Twitter: micromachine_jp, robotech_jp

Don't forget to visit MEMS Industry Group's booth at Exhibition Micromachine/MEMS!



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MEMS@DAC: Ready to Cross the Chasm


Birds of a Feather Meeting June 15, Anaheim, CA
At the 47th Annual Design Automation Conference (DAC), join Coventor, Cadence and other industry leaders for an open discussion about the evolving new eco-system required for MEMS + IC design and production. The MEMS industry is maturing and “ready to cross the chasm,” a serious business opportunity for many companies.

MEMS@DAC: Ready to Cross the Chasm: A Birds of Feather (BOF) meeting at DAC
Tuesday, June 15 at 6:30PM in Room 210AB of the Anaheim Convention Center
The two hour interactive discussion will be moderated by noted chip industry executive Jim Hogan.

Evolving the MEMS Design Approach for "Mainstream" Adoption

The present approach to MEMS design, with separate design tools and ad-hoc methods for transferring MEMS designs to IC design and verification tools is simply not up to these new challenges. New approaches are necessary to enhance MEMS design and bring it into the IC design mainstream, so design costs are reduced, time-to-market is shortened, and MEMS design is no longer confined to teams of specialists inside IDMs.



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